CHAITANYA BHARATHI INSTITUTE OF TECHNOLOGY (A)
  • E1-VLSI Technology(ELE-VI)-VIII-2020-21
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  • Course data
    General
    Announcements
    Slip Test-3
    UNIT-I:VLSI Technology Introduction
    L1: VLSI Technology Introduction
    L2: IC Review and History
    L3: VLSI Technology progress
    L4:Silicon as the base material
    L5: BJI fabrication Process
    L6:MOSFET fabrication process
    L7: Layer of ICs: substrate,Active layer and its functions
    L8: Oxide/Nitride,Metal/Poly Si layers and its functions
    L9:Clean room Technology
    Unit-I material
    Unit-I part2
    UNIT-II: Silicon Wafer preparation and cleaning Technology
    L10: Unit-II Crystal structure and planes
    L11: Crystal orientations, MGS, EGS preparation
    L12: CZ and FZ methods
    L13: Crystal defects and Gettering
    L14: Si shaping and wafer processing
    L15: Wafer processing and cleaning Technology
    Unit-II : Material
    UNIT-III: Oxide Growth and Lithography
    L16: Unit-III: Structure of SiO2,its functions
    L17- Slip Test-1 grades
    L18: Thermal Oxidation process
    L19:Kinetics of oxide growth
    L20: Lithography and Photo resists
    L21: Photo resists characteristics and Optical Lithography types
    L22:Optical lithography process, resolution and DOF
    L23: X ray and e beam Lithography
    Unit-III material
    L24:Summary of Unit-III
    UNIT- IV: Ion Implantation, Diffusion, Etching
    Unit-IV material
    Fabrication process material- brief and Overview of fabrication process
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210419-L25 Unit-IV Ion Implantation, Range and penetration depth
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210420- L26: Damage and Annealing process
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210426- L27 Ion implantation system
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210427- L28: Diffusion and ficks law
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210428- L29 Slip Test-2 grades
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210503- L30: Diffusion profiles
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210504- L31: Diffusion systems
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210505- L32: Etching: Wet etching
    Unit-V: Vapor Deposition, Packaging and Metallization
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210510- L33: Dry etching and Unit-V Introduction
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210511- L34: PVD and CVD methods
    Unit-V material
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210512- L35: Metallization and Packaging
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210517- L36: Testing and fabrication process videos
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210518- L37 Slip test-3 Grades
    AY20-21-UG-SEM8-ECE1-16ECE18-VLSIT-NJMR-20210519- L38 summary of Unit-V
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    E1-VLSI Technology(ELE-VI)-VIII-2020-21
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    Course info

    1. Home
    2. Courses
    3. Electronics and Communications Engineering
    4. UG
    5. Academic Year 2020-21
    6. VIII Semester
    7. E1-VLSI Technology(ELE-VI)-VIII-2020-21
    8. Summary

    E1-VLSI Technology(ELE-VI)-VIII-2020-21

    • Teacher: Sri N.Jagan Mohan Reddy Assistant Professor
    Skill Level: Beginner

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